Technical Analysis: Epson's High-Frequency Crystal Devices

Introduction

This technical analysis examines SeikoEpson Corporation's MHz-range crystal unit portfolio, focusing on their advanced timing solutions for precision applications. Crystal units serve as the fundamental timing reference in modern electronics, providing the stable frequency source required for digital communication, signal processing, and system synchronization. Epson's extensive experience in quartz crystal technology - dating back to 1959 with their Ina Plant - has positioned them as a leading supplier of high-performance timing components.

Fundamental Architecture and Technology

Epson's MHz-range crystal units operate using the piezoelectric effect in precisely cut quartz crystals. These components exploit mechanical resonance to generate electrical signals with extraordinarily stable frequency characteristics. The fundamental architecture comprises:

  1. Quartz Crystal Element: Precision-cut AT or SC-cut quartz blanks with optimized geometry for specific frequency ranges
  2. Electrode Structure: Ultra-thin metal films deposited on crystal surfaces in optimized patterns to initiate and sustain oscillation
  3. Hermetic Packaging: Ceramic or metal enclosures providing environmental isolation and mechanical protection
  4. Terminal Structure: Gold-plated or other specialized metal contacts providing electrical interface to the host PCB

The technology leverages several key engineering principles:

  • Blank Geometry Optimization: Controlling thickness-to-frequency ratios to achieve desired fundamental modes
  • Mass Loading Effects: Strategic metal deposition to fine-tune frequency characteristics
  • Temperature Compensation: Specialized crystal cuts and orientations to minimize frequency drift across operating temperatures
  • Energy Trapping: Design techniques to concentrate vibrational energy in the central portion of the crystal
Epson MHz Crystal Unit Internal Structure Metal Lid (Hermetic Seal) Ceramic Package Base Quartz Crystal Blank (AT-Cut) 35°15' Cut Angle Gold Electrode (Top) Gold Electrode (Bottom) Mounting Support Mounting Support Wire Bond Wire Bond Terminal Terminal Energy Trapping Region Note: Diagram not to scale. Electrode thicknesses are exaggerated for visibility.

Cross-sectionaldiagram of an Epson MHz crystal unit showing the AT-cut quartz blank, electrodestructure, wire bonds, and hermetic package. The energy trapping regionindicates where oscillation is concentrated for optimal performance.

Quartz Crystal Equivalent Circuit Model 1 2 C0 (Shunt Capacitance) L1 (Motional Inductance) C1 (Motional Capacitance) R1 (Equivalent Series Resistance) Resonance Frequencies Series Resonance: fs = 1/(2π√(L1·C1)) Parallel Resonance: fp = fs·√(1 + C1/C0) Typical Values for Epson MHz Crystals • C0: 3-7 pF • C1: 10-20 fF • L1: 5-20 mH • R1: 30-80 Ω

Quartz crystal equivalent circuit modelshowing the electrical characteristics of Epson's MHz-range crystal units.

Product Portfolio Analysis

Epson's MHz crystal portfolio spansmultiple package sizes and performance classes, strategically positioned toaddress diverse application requirements:

Ultra-Small Form Factor Solutions(FA1008AN)

  • Dimensions: 1.0 × 0.8 mm (industry's smallest footprint)
  • Frequency Range: 40-100 MHz
  • Standard Options: 52 MHz and 59.97 MHz (optimized for video processing)
  • ESR Values: Optimized for reliable startup in low-power oscillator circuits
  • Target Applications: Wearable devices, miniaturized wireless modules, space-constrained portable electronics

Compact High-Performance Units(FA1210AN)

  • Dimensions: 1.2 × 1.0 mm
  • Frequency Range: 32-100 MHz
  • Temperature Stability: ±10 ppm standard, ±5 ppm available
  • Operating Temperature: -40°C to +85°C standard, with extended range options
  • Key Feature: Superior phase noise characteristics for communication applications
  • Target Applications: Bluetooth modules, WLAN interfaces, mobile communications

Precision-Engineered FA-118T Series

  • Dimensions: 1.6 × 1.2 mm
  • Frequency Range: 24-54 MHz
  • Resonance Mode: Fundamental (for superior frequency stability)
  • Drive Level: Optimized for 100 μW operation
  • Aging Rate: < 3 ppm/year
  • Target Applications: Precision instrumentation, medical devices, test equipment

Thermistor-Integrated Solutions(FA2016ASA)

  • Dimensions: 2.0 × 1.6 mm
  • Built-in Temperature Sensor: Enables active temperature compensation
  • Operating Frequency: 38.4 MHz (optimized for digital communications)
  • Temperature Performance: ±5 ppm stability over full operating range
  • Unique Feature: Provides temperature data to host system for calibration
  • Target Applications: Telecommunications infrastructure, industrial control systems

Automotive-Grade Components (FA2016AA)

  • Dimensions: 2.0 × 1.6 mm
  • Frequency Range: 19.2-54 MHz
  • Qualification: AEC-Q200 compliant
  • Extended Temperature Range: -40°C to +125°C
  • Enhanced Shock Resistance: Specialized mounting structure
  • Target Applications: Vehicle ECUs, safety systems, infotainment, telematics

Performance Characteristics andTechnical Specifications

The performance of Epson's MHz crystalunits is quantified through several critical parameters:

Frequency Stability

  • Temperature Coefficient: Typically ±10 ppm to ±50 ppm across operating temperature range
  • Aging: +5/-3 ppm maximum in first year at 25°C (superior to industry standards)
  • Load Sensitivity: <±5 ppm for load capacitance variation of  ±10%
  • Supply Voltage Coefficient: <±0.5 ppm/V (critical for battery-powered applications)

Electrical Specifications

  • ESR (Equivalent Series Resistance): Ranges from 30Ω to 80Ω  depending on frequency and package
  • Drive Level: 100 μW standard, with options for lower power operation
  • Load Capacitance: 8 pF to 12 pF standard (application-specific optimization available)
  • Shunt Capacitance (C0): 3-7 pF typical (varies by package and frequency)

Environmental Performance

  • Operating Temperature: Standard range of -40°C to +85°C, with extended options to +105°C
  • Storage Temperature: -55°C to +125°C
  • Humidity Resistance: Conforms to MIL-STD-202, Method 103
  • Shock Resistance: 3,000G, 0.3ms, ½ sine
  • Vibration Resistance: 20G from 10Hz to 2,000Hz

Package Characteristics

  • Moisture Sensitivity Level: MSL 1 (unlimited floor life at <30°C/60% RH)
  • Terminal Plating: Gold over nickel (Au/Ni) standard, with RoHS-compliant options
  • Hermetic Seal: <5×10^-8 atm-cc/sec
  • Thermal Resistance: 125°C/W typical (critical for high-temperature applications)
Epson Crystal Package Size Evolution Miniaturization Trend in MHz Range Crystals 2000 2005 2010 2015 2020+ HC-49/S 11.05 × 4.65 mm FA-238 3.2 × 2.5 mm FA-128 1.6 × 1.2 mm FA-118T 1.2 × 1.0 mm FA1008AN 1.0 × 0.8 mm ~99% Volume Reduction (While maintaining or improving performance specifications) Package sizes shown approximately to scale. Actual dimensions may vary slightly by specific part number.

Evolution of Epson's crystal package sizes from 2000 to present, showing the dramatic miniaturization trend while maintaining or improving performance specifications. The ~99% volume reduction represents one of the industry's most significant achievements in component miniaturization.

Critical Design Considerations

Implementing Epson's MHz crystals requirescareful attention to several circuit-level factors:

Negative Resistance Allocation

The oscillation circuit must providesufficient negative resistance to initiate and sustain oscillation:

  • Required negative resistance (R) > 5 × ESR of crystal
  • Typical design margin: 3-5× the minimum required value to ensure reliable startup

Drive Level Management

Controlling the power dissipated in thecrystal is essential for long-term reliability:

  • Drive level (P) = i² × Re, where i is current through crystal and Re is effective resistance
  • Maximum recommended drive level: 100 μW for standard units
  • Exceeding drive level specifications results in frequency shift and potential damage

Load Capacitance Matching

Precise capacitance matching is critical for achieving specified frequency:

  • Effective load capacitance (CL) = (C1 × C2) / (C1 + C2) + Cstray
  • Where C1 and C2 are external capacitors and Cstray is parasitic capacitance
  • PCB layout significantly impacts effective capacitance through parasitic effects
  • Recommended approach: Design for CL = specified load  capacitance - 2 pF to account for strays

PCB Layout Optimization

Layout considerations significantly impactoscillator performance:

  • Crystal should be placed as close as possible to oscillator circuit (≤10 mm)
  • Ground plane isolation below crystal recommended to minimize EMI susceptibility
  • Guard traces around crystal connections for reduced crosstalk
  • Avoid routing high-speed signals beneath or adjacent to crystal package

Comparative Analysis with CompetingTechnologies

Epson's crystal technology offers distinctadvantages compared to alternative timing solutions:

vs. MEMS Oscillators

  • Superior phase noise performance: 10-15 dB better at close-in offsets
  • Better temperature stability without compensation: ±10 ppm vs  ±50 ppm raw performance
  • Lower aging rate: <5 ppm/year vs 10-20 ppm/year
  • Higher Q factor: Typically 10,000-40,000 vs 1,000-2,000 for MEMS

vs. Ceramic Resonators

  • Significantly better frequency stability: ±10 ppm vs ±2500 ppm
  • Superior temperature characteristics: 5× better temperature coefficient
  • Better aging characteristics: <5 ppm/year vs >20 ppm/year
  • Trade-off: Higher cost and slightly larger size than ceramic options

vs. SAW Resonators

  • Lower cost structure for frequencies <100 MHz
  • Lower current consumption: Typically 30% less power at equivalent frequencies
  • Better startup characteristics at low temperatures
  • Trade-off: Cannot achieve the higher frequencies possible with SAW technology
Frequency-Temperature Characteristics Epson MHz Range Crystal Units -40°C -20°C 0°C 20°C 40°C 60°C 80°C 100°C 125°C Temperature (°C) +25 +15 +5 0 -5 -15 -25 Frequency Deviation (ppm) 25°C Reference Inflection Point AT-cut Fundamental (FA-238) AT-cut 3rd Overtone Silicon MEMS Alternative Lower temperature coefficient near room temperature Greater deviation at temperature extremes

Frequency-temperature characteristics of Epson crystal units showing the superior stability of AT-cut crystals in both fundamental and overtone modes compared to silicon MEMS alternatives. Note the characteristic inflection point and minimal deviation near room temperature.

Optimized PCB Layout for Epson Crystal Implementation MCU/ASIC with Oscillator Circuit Epson Crystal Unit CL1 CL2 Layout Best Practices: Minimal trace length Guard ring (GND) Signal keep-out area Isolated ground plane Ground connection PCB Layout Best Practices for Epson MHz-Range Crystal Units • Keep traces < 10mm • Symmetrical capacitor placement • Isolate ground plane • Use guard ring • Avoid high-speed signals nearby • Match specified load capacitance

Optimized PCB layout for Epson crystal implementation showing best practices for reliable oscillator design. The diagram illustrates critical layout elements including the isolated ground plane beneath the crystal, a guard ring connected to ground for EMI protection, and the signal keep-out area to prevent interference from high-speed signals. For optimal performance, traces between the crystal and load capacitors should be kept under 10mm, with symmetrical capacitor placementto maintain balanced loading.

Application Recommended Series Featured Part Numbers Key Considerations
Mobile Devices & Wearables FA-128, FA-118T, FA-20H FA-128 32.0000MF10Z-AJ0, FA-118T 26.0000MF12Z-AC3, FA-20H 16.0000MF10Z-AJ0 Low current consumption, ultra-small footprint, <2-5ms wake-up time, EMI shielding
Bluetooth & RF Modules FA-128, TSX-3225 FA-128 32.0000MF10Z-W0, TSX-3225 26.0000MF10Z-AC6 Excellent phase noise, optimized for 2.4GHz applications
IoT Devices FA-128, FA-118T FA-128 24.0000MF10Z-W0, FA-118T 24.0000MF10Z-W0 Battery optimization, small size, cost-efficiency
Automotive (AEC-Q200) FA-2016AA, FA-238 FA-238 24.0000MD30X-W5, FA-238 25.0000MD30X-C3 -40°C to +125°C operation, vibration resistance, 5× oscillator margin
Telecommunications FA-2016ASA, TSX-3225 TSX-3225 38.4000MF10Z-AS0, FA-238 50.0000MB30X-K3 Low jitter, temperature compensation, holdover support
USB & PC Peripherals TSX-3225, FA-238 TSX-3225 24.0000MF10Z-AC0, FA-238 48.0000MB-K0 Stability across operating temperatures, USB compatibility
Consumer Electronics FA-238, TSX-3225 FA-238 16.0000MB-K0, TSX-3225 32.0000MF10Z-K0 Cost-effectiveness, standard frequencies, high volume stability
General Computing FA-238, TSX-3225 TSX-3225 25.0000MF20X-C0, FA-238 25.0000MB-C0 Standard performance, moderate stability requirements
Industrial Control TSX-3225, FA-20H TSX-3225 27.0000MF20X-AJ6, FA-20H 32.0000MF20X-K0 High-immunity design, vibration tolerance, wide temperature range
Medical Devices FA-20H, TSX-3225 FA-20H 40.0000MF10Z-K0, TSX-3225 40.0000MF10Z-AC0 High reliability, stability, low aging characteristics
Precision Instrumentation TSX-3225, FA-238 TSX-3225 24.0000MF15X-AC6, FA-238 25.0000MB50X-C0 Tight stability, excellent phase noise, temperature performance

Compliance and ReliabilityConsiderations

Epson's crystal units are manufactured tomeet stringent industry standards:

Environmental Compliance

  • EU RoHS Directive 2011/65/EU compliant
  • REACH compliance for all components
  • Halogen-free per IEC 61249-2-21
  • China RoHS (SJ/T 11363-2006) compliant

Reliability Metrics

  • MTTF: >500 million hours at 25°C (based on accelerated life testing)
  • FIT Rate: <2 failures per billion device hours
  • Qualification: Performed to JESD47 requirements
  • Reliability Reports: Available for specific part numbers upon request

Quality Assurance

  • Manufacturing facilities ISO 9001 and IATF 16949 certified
  • 100% electrical testing on all units
  • SPC monitoring of critical parameters during production
  • Extended reliability testing on sample basis from each production lot

Conclusion

Epson's MHz-range crystal units representstate-of-the-art timing technology with exceptional performance characteristics across frequency stability, phase noise, and reliability metrics. Their diverse portfolio spans ultra-miniature components for space-constrained portable devices to high-reliability automotive-grade solutions for safety-critical applications.

The integration of advanced features suchas built-in thermistors for temperature sensing, specialized plating for harsh environments, and automotive-grade qualification demonstrates Epsons commitment to addressing the evolving requirements of precision timing applications. These technical advantages, coupled with comprehensive documentation and design support, position Epson as a leading supplier in the high-performance timing component market.

 

This technical analysis is based on Epson's Crystal Master 2024 catalog and supplementary engineering documentation. For design assistance in selecting the optimal crystal componentfor your specific application, our engineering team is available to provide expert consultation and support.

Link to download Epson's Crystal Master2024 catalog:

https://www.epsondevice.com/crystal/en/products/catalog/pdf/catalog.pdf

Contact Us

Looking for professional assistance withEpson timing solutions? Our component specialists are ready to help with yourEPSON product selection!

📧 Email: contact@sagacomponents.com
📞 Phone:+46 (0) 8 564 708 00
🌐 Web: https://www.epsondevice.com/crystal/en/products/crystal-unit/

EPSON Part Numbers Quick Reference

MHz-Range Crystal Units

TSX-3225 Series (3.2 × 2.5 × 0.6mm)

TSX-3225 16.0000MF09Z-AC0, TSX-322516.0000MF09Z-AC3, TSX-3225 16.0000MF09Z-AC6, TSX-3225 16.0000MF10U-B0, TSX-322516.0000MF10U-B3, TSX-3225 16.0000MF10U-B6, TSX-3225 16.0000MF10Z-B0, TSX-322516.0000MF10Z-B6, TSX-3225 16.0000MF10Z-K6, TSX-3225 16.0000MF18X-AC0, TSX-322516.0000MF18X-AC3, TSX-3225 16.0000MF18X-AC6, TSX-3225 16.0000MF18X-AJ6,TSX-3225 16.0000MF18X-B0, TSX-3225 16.0000MF18X-G6, TSX-3225 16.0000MF20X-AJ6,TSX-3225 16.0000MF20X-W6, TSX-3225 19.2000MF15Y-AJ6, TSX-3225 19.2000MF18X-W0,TSX-3225 19.2000MF20X-W6, TSX-3225 20.0000MF10V-K0, TSX-3225 20.0000MF10Z-AC0,TSX-3225 20.0000MF10Z-AC6, TSX-3225 20.0000MF15P-AC0, TSX-3225 20.0000MF18X-W0,TSX-3225 20.0000MF20G-AC0, TSX-3225 20.0000MF20G-AC3, TSX-3225 20.0000MF20X-K0,TSX-3225 20.0000MF20X-K6, TSX-3225 20.0000MF20X-W0, TSX-3225 20.0000MF20X-W3,TSX-3225 20.0000MF20X-W6, TSX-3225 22.576649MF10Z-K6, TSX-3225 24.0000MD30X-C3,TSX-3225 24.0000MF10P-G0, TSX-3225 24.0000MF10U-W0, TSX-3225 24.0000MF10Z-AC0,TSX-3225 24.0000MF10Z-AC6, TSX-3225 24.0000MF10Z-AJ0, TSX-322524.0000MF10Z-AJ6, TSX-3225 24.0000MF10Z-C0, TSX-3225 24.0000MF10Z-K6, TSX-322524.0000MF15P-C0, TSX-3225 24.0000MF15V-C0, TSX-3225 24.0000MF15X-AC0, TSX-322524.0000MF15X-AC3, TSX-3225 24.0000MF15X-AC6, TSX-3225 24.0000MF15X-AG0, TSX-322524.0000MF15Y-AC0, TSX-3225 24.0000MF15Y-AC6, TSX-3225 24.0000MF15Y-W6, TSX-322524.0000MF18X-AC0, TSX-3225 26.0000MF10P-AG6, TSX-3225 26.0000MF10P-AJ6,TSX-3225 26.0000MF10P-AS6, TSX-3225 26.0000MF10P-JK6, TSX-3225 26.0000MF10Y-A6,TSX-3225 26.0000MF10Y-K0, TSX-3225 26.0000MF10Y-Y0, TSX-3225 26.0000MF10Y-Y6,TSX-3225 26.0000MF10Z-A0, TSX-3225 26.00M-C0AANNG40RG6, TSX-322526.6353MF10Z-G0, TSX-3225 26.6353MF10Z-G6, TSX-3225 27.0000MF10P-B3, TSX-322527.0000MF10P-C6, TSX-3225 27.0000MF10Z-AC0, TSX-3225 27.0000MF10Z-AC6, TSX-322527.0000MF10Z-D5, TSX-3225 27.0000MF10Z-K0, TSX-3225 27.0000MF10Z-K6, TSX-322527.0000MF10Z-W0, TSX-3225 27.1200MF18X-W0, TSX-3225 27.1200MF18X-W6, TSX-322527.12M-A0AAYYG40RE0, TSX-3225 28.63636MF18X-C0, TSX-3225 30.0000MF09Z-W0, TSX-322532.0000MF10P-B0, TSX-3225 32.0000MF10P-W6, TSX-3225 32.0000MF17X-B3, TSX-322532.0000MF18X-AJ6, TSX-3225 32.0000MF20X-AC5, TSX-3225 32.0000MF20X-AG0,TSX-3225 32.0000MF20X-AJ0, TSX-3225 32.0000MF20X-W0, TSX-322532.00M-A0AANNG40RG6, TSX-3225 36.4000MF20X-AS, TSX-3225 37.4000MF10Y-K3,TSX-3225 38.4000MF10Z-AS0, TSX-3225 38.4000MF10Z-AS3, TSX-322538.4000MF15Y-AJ0, TSX-3225 39.0000MF10Z-G0, TSX-3225 39.0000MF10Z-G6, TSX-322539.0000MF11P-AJ0, TSX-3225 TSX-3225 40.0000MF15X-K0, TSX-3225 40.0000MF15X-K6,TSX-3225 40.0000MF15Y-K0, TSX-3225 40.0000MF15Y-K6, TSX-3225 40.0000MF20X-K0,TSX-3225 40.0000MF30G-AG6, TSX-3225 40.00M-A0AANNH40RE0, TSX-322540.00M-A0AANNH40RE6, TSX-3225 40.00M-C0AAAAU40RE0, TSX-322540.00M-C0AANNG40RG0, TSX-3225 40.00M-C0AANNG40RG6, TSX-3225 44.0000MF10V-W0,TSX-3225 48.0000MF10P-K0, TSX-3225 48.0000MF10P-K6, TSX-3225 48.0000MF10Y-K0,TSX-3225 48.0000MF10Y-K6, TSX-3225 48.0000MF10Z-B6, TSX-3225 48.0000MF10Z-K0,TSX-3225 48.0000MF10Z-K6, TSX-3225 48.0000MF10Z-W0, TSX-3225 48.0000MF10Z-W4,TSX-3225 48.0000MF10Z-W5, TSX-3225 48.0000MF10Z-W6, TSX-3225 48.0000MF15X-AJ0,TSX-3225 48.0000MF20X-AJ0, TSX-3225 48.0000MF20X-AJ6, TSX-3225 48.0000MF20X-W0,TSX-3225 48.0000MF20X-W4, TSX-3225 48.0000MF20X-W5, TSX-3225 48.0000MF20X-W6,TSX-3225 48.00M-70AAAAU40RE0, TSX-3225 48.00M-70AAAAU40RE6, TSX-322548.00M-80AANNU40RG0

FA-238 Series (3.2 × 2.5 × 0.7mm)

FA-238 12.0000MB-C0, FA-238 12.0000MB-C3,FA-238 14.31818MB50X-K3, FA-238 16.0000MA30X-AG0, FA-238 16.0000MA30X-AG5,FA-238 16.0000MB-C, FA-238 16.0000MB-C0, FA-238 16.0000MB-C3, FA-23816.0000MB-K, FA-238 16.0000MB-K0, FA-238 16.0000MB-K3, FA-238 16.3840MB-C,FA-238 16.3840MB-K, FA-238 16.6666MB-C3, FA-238 16.9344MA-B5, FA-23818.0000MB-C0, FA-238 18.4320MB-C0, FA-238 18.4320MB-C3, FA-238 18.4320MB-K0,FA-238 18.4320MB-K3, FA-238 18.4320MB-R3, FA-238 19.2000MB-K3, FA-23819.9680MA30X-AG5, FA-238 20.0000MA50X-AG3, FA-238 20.0000MB-K, FA-23820.0000MB-K0, FA-238 24.0000MB-C, FA-238 24.0000MB-C0, FA-238 24.0000MB-C3,FA-238 24.0000MB-W0, FA-238 24.0000MB50X-K0, FA-238 24.0000MD30X-W5, FA-23825.0000MD30X-C0, FA-238 25.0000MD30X-C3, FA-238 25.0000MHZ, FA-238 26.0000MB-B3,FA-238 27.0000MB-C3, FA-238 27.0000MB-Y0, FA-238 30.0000MB-C, FA-23830.0000MB-C0, FA-238 30.0000MB-C3, FA-238 30.0000MB-F3, FA-238 30.0000MB-Y0,FA-238 33.0000MB-C0, FA-238 36.0000MB-C0, FA-238 40.0000MB-C, FA-23840.0000MB-C0, FA-238 40.0000MB-K0, FA-238 48.0000MB-G0, FA-238 48.0000MB-K,FA-238 48.0000MB-K0, FA-238 48.0000MB-K3, FA-238 49.1520MB30X-K0, FA-23849.1520MB30X-K5, FA-238 50.0000MB-B3, FA-238 50.0000MB-G0, FA-23850.0000MB30X-K0, FA-238 50.0000MB30X-K3, FA-238 50.0000MB30X-K5, FA-23850.0000MD50X-FF0

FA-128 Series (2.0 × 1.6 × 0.5mm)

FA-128 20.00M-A0AAYYG80RE0, FA-12824.0000MF10Z-W0, FA-128 24.0000MF10Z-W3, FA-128 25.0000MF10Z-AC0, FA-12825.0000MF10Z-AC3, FA-128 25.0000MF20X-K0, FA-128 25.0000MF20X-K3, FA-12826.0000MF10Z-W, FA-128 26.0000MF10Z-W0, FA-128 26.0000MF10Z-W3, FA-128 26.0000MF10Z-W5,FA-128 26.0000MF10Z-AC3, FA-128 32.0000MD30Z-C3, FA-128 32.0000MF10Z-AJ, FA-12832.0000MF10Z-AJ0, FA-128 32.0000MF10Z-AJ3, FA-128 32.0000MF10Z-AJ5, FA-12832.0000MF10Z-W0, FA-128 32.0000MF10Z-W3, FA-128 32.0000MF20X-K, FA-12832.0000MF20X-K0, FA-128 32.0000MF20X-K3, FA-128 32.0000MF20X-K5, FA-12840.0000MF10Z-K0, FA-128 40.0000MF10Z-K3, FA-128 40.0000MF20X-K, FA-12840.0000MF20X-K0, FA-128 48.0000MF20X-K0

FA-20H Series (2.5 × 2.0 × 0.55mm)

FA-20H 12.0000MD30V-K, FA-20H12.0000MD30Z-K3, FA-20H 12.0000MD30Z-K5, FA-20H 16.0000MF10Z-AC0, FA-20H16.0000MF10Z-AC3, FA-20H 16.0000MF10Z-AJ0, FA-20H 16.0000MF10Z-AJ3, FA-20H16.0000MF10Z-AJ5, FA-20H 16.0000MF12V-AJ3, FA-20H 16.0000MF12Z-AC0, FA-20H 16.0000MF12Z-AC3,FA-20H 16.0000MF20X-B, FA-20H 18.0000MF10Z-AJ3, FA-20H 19.2000MF12Y-AG3, FA-20H24.0000MF15Y-W3, FA-20H 24.0000MF20X-K0, FA-20H 24.0000MF20X-K3, FA-20H25.0000MD30Y-C, FA-20H 25.0000MD30Y-C0, FA-20H 25.0000MD30Y-C3, FA-20H25.0000MF20X-K0, FA-20H 26.0000MF10Z-AC3, FA-20H 26.0000ML81Z-AC3, FA-20H27.0000MF20X-K3, FA-20H 30.0000MF20X-W0, FA-20H 32.0000MF12Y-W0, FA-20H32.0000MF12Y-W3, FA-20H 32.0000MF20X-K0, FA-20H 32.0000MF20X-K3, FA-20H32.0000MF20X-K5, FA-20H 38.4000MF10Z-AS0, FA-20H 38.4000MF10Z-AS3, FA-20H40.0000MF10Z-K0, FA-20H 40.0000MF10Z-K3, FA-20H 40.0000MF15Z-AC3

FA-238V Series (3.2 × 2.5 × 0.7mm)

FA-238V 12.0000MA-C0, FA-238V 12.0000MA-C5,FA-238V 12.0000MB-K0, FA-238V 12.0000MB-K3, FA-238V 12.0000MB-W, FA-238V12.0000MB-W0, FA-238V 12.0000MB-W5, FA-238V 12.0000MB50X-C0, FA-238V12.0000MF10V-K0, FA-238V 13.0000MB-K0, FA-238V 13.0000MB-K3, FA-238V14.7456MB-K3

FA-118T Series (1.6 × 1.2 × 0.35mm)

FA-118T 24.0000MF10Z-W0, FA-118T26.0000MF12Z-AC3, FA-118T 27.1200MD50Z-K3, FA-118T 52.0000ME12Z-AC3

 

Keywords:Epson crystal units, FA-238, TSX-3225, FA-128, FA-20H, MHz crystals, oscillatorcomponents, Q22FA2380040512, X1E000021011912, Q22FA1280002512, timingsolutions, quartz resonators, frequency control

Hashtags:#EpsonCrystal #TimingComponents #FrequencyControl #ElectronicDesign #TSX3225#FA238 #FA128 #FA20H #CrystalOscillator